U1
CXD90060GG
SoC / APU
BGA
Main APU
Used on 1 board
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About this component
The APU combines CPU and GPU and drives the 16 GB GDDR6 pool. Clocks vary with power load, so the 10.28 TFLOPS figure is a peak. Launch units use liquid metal as the thermal interface; disturbing it or a leak can damage nearby parts, so the cooler should only be removed with care. Later board revisions shrink the APU die. Part variants: CXD90060GG on EDM-010 (CFI-10xx). CFI-12xx (EDM-030) uses a smaller APU die; later and Slim part numbers not confirmed.
What it does on this board
8-core Zen 2 up to 3.5GHz with a 36 CU RDNA 2 GPU (~10.28 TFLOPS).
Pinout & readings
No pinout or reference readings yet — these show what each pin does and what a healthy part should measure.