IBM Xenon
About this component
Xenon is the Xbox 360's custom three-core PowerPC processor, each core running two hardware threads with an enhanced VMX128 vector unit. On the original 'fat' boards it is a separate chip under its own heatsink, linked to the GPU, which holds the memory controller. It went from 90 nm to 65 nm (Falcon onwards); on the Slim (Trinity, Corona) it no longer exists as a separate chip because it was merged with the GPU into the XCGPU. Like the GPU it is a BGA part, so heat-related solder problems on early boards can involve either chip. Part variants: Separate CPU die on Xenon to Tonasket boards (90 nm, then 65 nm from Falcon). From Trinity (360 S) onward the CPU and GPU are merged in one 45 nm XCGPU, and a 32 nm version on Winchester.
3.2GHz triple-core PowerPC CPU.
Pinout & readings
No pinout or reference readings yet — these show what each pin does and what a healthy part should measure.