U1
CXD90060GG
SoC / APU
BGA
Main APU
About this component
The APU combines CPU and GPU and drives the 16 GB GDDR6 pool. Clocks vary with power load, so the 10.28 TFLOPS figure is a peak. Launch units use liquid metal as the thermal interface; disturbing it or a leak can damage nearby parts, so the cooler should only be removed with care. Later board revisions shrink the APU die. Part variants: CXD90060GG on EDM-010 (CFI-10xx). CFI-12xx (EDM-030) uses a smaller APU die; later and Slim part numbers not confirmed.
What it does on this board
8-core Zen 2 up to 3.5GHz with a 36 CU RDNA 2 GPU (~10.28 TFLOPS).
Pinout & readings
No pinout or reference readings yet — these show what each pin does and what a healthy part should measure.